YHMG7430 HIGH PRECISION VERTICAL SINGLE SURFACE GRINDING MACHINE
YHMG7430 HIGH PRECISION VERTICAL SINGLE SURFACE GRINDING MACHINE
This machine is mainly used for precision thinning of hard and brittle materials such as sapphire, silicon wafers, germanium wafers, silicon carbide, gallium nitride, gallium arsenide, silicon nitride, and ceramics. It is a precision thinning equipment suitable for 4 to 12 inch specifications.
MAIN FEATURES
- The grinding wheel adopts a 12-inch national standard diamondgrinding wheel. The selection of the grinding wheel particle size iscustomized according to the customer’s process requirements; thethinning unit adopts the axial feed (In-Feed) grinding principle, which iscompatible with 300~50mm wafer grinding and thinning processing.
- The Machine has functions such as multi-stage grinding program andoverload waiting to meet various process requirements.
- The grinding wheel spindle adopts a high-precision air-floating specialelectric spindle, which is controlled by the CNC system through thefrequency converter for speed regulation, and the process speed can bedetermined according to different products.
- In order to achieve high-precision and high-quality processing, it isequipped with a high-rigidity, low-vibration, and low-thermal expansionair-floating spindle. The spindle of the workbench is also equipped withhigh-rigidity, low-vibration, and low-thermal expansion air bearingcomponents.
- High-precision screw and guide rail components are used, and thedriving method is driven by a servo full closed-loop control system.
MAINTECHNICAL PARAMETERS
TYPICAL PROCESSING PARTS
